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Damage Evolution and Failure of SiC/SiC Composites with Film-Cooling Holes Under Extreme Temperatures

The International Conference on Computational & Experimental Engineering and Sciences · Dafei Wang, Xinmei Wang, Shouyi Sun · 2026

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Quick facts

Author
Dafei Wang, Xinmei Wang, Shouyi Sun ref
Published
ref
Publisher
Tech Science Press ref
Journal
The International Conference on Computational & Experimental Engineering and Sciences ref

Questions

Who wrote Damage Evolution and Failure of SiC/SiC Composites with Film-Cooling Holes Under Extreme Temperatures?
Damage Evolution and Failure of SiC/SiC Composites with Film-Cooling Holes Under Extreme Temperatures was written by Dafei Wang, Xinmei Wang, Shouyi Sun.
When was Damage Evolution and Failure of SiC/SiC Composites with Film-Cooling Holes Under Extreme Temperatures first published?
Damage Evolution and Failure of SiC/SiC Composites with Film-Cooling Holes Under Extreme Temperatures was first published in 2026.

Sources

  1. Publisher record (DOI, via Crossref)

Last updated · facts checked 26 October 2026

Cite this page

"Damage Evolution and Failure of SiC/SiC Composites with Film-Cooling Holes Under Extreme Temperatures". DigiNepal. Last updated 26 October 2026. https://diginpl.com/books/paper-icces-2026-014620. Retrieved 14 November 2026.

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Open-access publication. Read it free at the publisher: https://doi.org/10.32604/icces.2026.014620.

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