{"id":"paper-icces-2026-014620","type":"book","url":"https://diginpl.com/books/paper-icces-2026-014620","language":"en","name":"Damage Evolution and Failure of SiC/SiC Composites with Film-Cooling Holes Under Extreme Temperatures","name_en":"Damage Evolution and Failure of SiC/SiC Composites with Film-Cooling Holes Under Extreme Temperatures","name_ne":null,"description":"The International Conference on Computational & Experimental Engineering and Sciences · Dafei Wang, Xinmei Wang, Shouyi Sun · 2026","headline":"The International Conference on Computational & Experimental Engineering and Sciences · Dafei Wang, Xinmei Wang, Shouyi Sun · 2026","also_known_as":[],"summary":"","summary_more":[],"facts":[{"key":"authors","label":"Author","values":[{"text":"Dafei Wang"},{"text":"Xinmei Wang"},{"text":"Shouyi Sun"}],"source":{"label":"Crossref","url":"https://doi.org/10.32604/icces.2026.014620"}},{"key":"published","label":"Published","values":[{"text":"2026","date":"2026"}],"source":{"label":"Crossref","url":"https://doi.org/10.32604/icces.2026.014620"}},{"key":"publisher","label":"Publisher","values":[{"text":"Tech Science Press"}],"source":{"label":"Crossref","url":"https://doi.org/10.32604/icces.2026.014620"}},{"key":"journal","label":"Journal","values":[{"text":"The International Conference on Computational & Experimental Engineering and Sciences"}],"source":{"label":"Crossref","url":"https://doi.org/10.32604/icces.2026.014620"}},{"key":"doi","label":"DOI","values":[{"text":"10.32604/icces.2026.014620","url":"https://doi.org/10.32604/icces.2026.014620"}],"source":{"label":"Crossref","url":"https://doi.org/10.32604/icces.2026.014620"}}],"office":null,"sections":[],"cited":[],"cited_from":null,"videos":[],"last_reviewed":null,"organizations":[],"same_as":["https://doi.org/10.32604/icces.2026.014620"],"faq":[{"q":"Who wrote Damage Evolution and Failure of SiC/SiC Composites with Film-Cooling Holes Under Extreme Temperatures?","a":"Damage Evolution and Failure of SiC/SiC Composites with Film-Cooling Holes Under Extreme Temperatures was written by Dafei Wang, Xinmei Wang, Shouyi Sun."},{"q":"When was Damage Evolution and Failure of SiC/SiC Composites with Film-Cooling Holes Under Extreme Temperatures first published?","a":"Damage Evolution and Failure of SiC/SiC Composites with Film-Cooling Holes Under Extreme Temperatures was first published in 2026."}],"related":[],"places_in":[],"nearby":[],"image":null,"sources":[{"label":"Publisher record (DOI, via Crossref)","url":"https://doi.org/10.32604/icces.2026.014620","license":null}],"license":null,"attribution":"Open-access publication. Read it free at the publisher: https://doi.org/10.32604/icces.2026.014620.","cite":"\"Damage Evolution and Failure of SiC/SiC Composites with Film-Cooling Holes Under Extreme Temperatures\". DigiNepal. Last updated 26 October 2026. https://diginpl.com/books/paper-icces-2026-014620. Retrieved 14 November 2026.","date_modified":"2026-10-26T06:20:31Z","facts_checked":"2026-10-26","alternates":{"html":"https://diginpl.com/books/paper-icces-2026-014620","en":"https://diginpl.com/books/paper-icces-2026-014620","ne":null}}