# Damage Evolution and Failure of SiC/SiC Composites with Film-Cooling Holes Under Extreme Temperatures

_The International Conference on Computational & Experimental Engineering and Sciences · Dafei Wang, Xinmei Wang, Shouyi Sun · 2026_

Canonical: https://diginpl.com/books/paper-icces-2026-014620
Last updated: 2026-10-26

## Quick facts

- **Author:** Dafei Wang; Xinmei Wang; Shouyi Sun ([Crossref](https://doi.org/10.32604/icces.2026.014620))
- **Published:** 2026 ([Crossref](https://doi.org/10.32604/icces.2026.014620))
- **Publisher:** Tech Science Press ([Crossref](https://doi.org/10.32604/icces.2026.014620))
- **Journal:** The International Conference on Computational & Experimental Engineering and Sciences ([Crossref](https://doi.org/10.32604/icces.2026.014620))
- **DOI:** 10.32604/icces.2026.014620 ([Crossref](https://doi.org/10.32604/icces.2026.014620))

## Questions

**Who wrote Damage Evolution and Failure of SiC/SiC Composites with Film-Cooling Holes Under Extreme Temperatures?**  
Damage Evolution and Failure of SiC/SiC Composites with Film-Cooling Holes Under Extreme Temperatures was written by Dafei Wang, Xinmei Wang, Shouyi Sun.

**When was Damage Evolution and Failure of SiC/SiC Composites with Film-Cooling Holes Under Extreme Temperatures first published?**  
Damage Evolution and Failure of SiC/SiC Composites with Film-Cooling Holes Under Extreme Temperatures was first published in 2026.

## Sources

- [Publisher record (DOI, via Crossref)](https://doi.org/10.32604/icces.2026.014620)

## Licence and attribution

Open-access publication. Read it free at the publisher: https://doi.org/10.32604/icces.2026.014620.

## Cite this page

"Damage Evolution and Failure of SiC/SiC Composites with Film-Cooling Holes Under Extreme Temperatures". DigiNepal. Last updated 26 October 2026. https://diginpl.com/books/paper-icces-2026-014620. Retrieved 14 November 2026.