Topological Optimisation Design of Nanofluid-Cooled Microchannel Heat Sink Using a Three-Layer Thermofluid Model for Electronics Cooling
Computer Modeling in Engineering & Sciences · Bin Zhang, Xuanyan Lu, Zhigang Qin et al. · 2026
Open-access book. Read it free at the publisher: https://doi.org/10.32604/cmes.2026.086481.