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Topological Optimisation Design of Nanofluid-Cooled Microchannel Heat Sink Using a Three-Layer Thermofluid Model for Electronics Cooling

Computer Modeling in Engineering & Sciences · Bin Zhang, Xuanyan Lu, Zhigang Qin et al. · 2026

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Quick facts

Author
Bin Zhang, Xuanyan Lu, Zhigang Qin, Yibo Mo, Chenwei Wang, Sihui Hao, Yixiang Song, Jianyun Xu ref
Published
ref
Publisher
Tech Science Press ref
Journal
Computer Modeling in Engineering & Sciences ref

Questions

Who wrote Topological Optimisation Design of Nanofluid-Cooled Microchannel Heat Sink Using a Three-Layer Thermofluid Model for Electronics Cooling?
Topological Optimisation Design of Nanofluid-Cooled Microchannel Heat Sink Using a Three-Layer Thermofluid Model for Electronics Cooling was written by Bin Zhang, Xuanyan Lu, Zhigang Qin, Yibo Mo.
When was Topological Optimisation Design of Nanofluid-Cooled Microchannel Heat Sink Using a Three-Layer Thermofluid Model for Electronics Cooling first published?
Topological Optimisation Design of Nanofluid-Cooled Microchannel Heat Sink Using a Three-Layer Thermofluid Model for Electronics Cooling was first published in 2026.

Sources

  1. Publisher record (DOI, via Crossref)

Last updated · facts checked 2 November 2026

Cite this page

"Topological Optimisation Design of Nanofluid-Cooled Microchannel Heat Sink Using a Three-Layer Thermofluid Model for Electronics Cooling". DigiNepal. Last updated 2 November 2026. https://diginpl.com/books/paper-cmes-2026-086481. Retrieved 14 November 2026.

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Open-access publication. Read it free at the publisher: https://doi.org/10.32604/cmes.2026.086481.

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