{"id":"paper-cmes-2026-086481","type":"book","url":"https://diginpl.com/books/paper-cmes-2026-086481","language":"en","name":"Topological Optimisation Design of Nanofluid-Cooled Microchannel Heat Sink Using a Three-Layer Thermofluid Model for Electronics Cooling","name_en":"Topological Optimisation Design of Nanofluid-Cooled Microchannel Heat Sink Using a Three-Layer Thermofluid Model for Electronics Cooling","name_ne":null,"description":"Computer Modeling in Engineering & Sciences · Bin Zhang, Xuanyan Lu, Zhigang Qin et al. · 2026","headline":"Computer Modeling in Engineering & Sciences · Bin Zhang, Xuanyan Lu, Zhigang Qin et al. · 2026","also_known_as":[],"summary":"","summary_more":[],"facts":[{"key":"authors","label":"Author","values":[{"text":"Bin Zhang"},{"text":"Xuanyan Lu"},{"text":"Zhigang Qin"},{"text":"Yibo Mo"},{"text":"Chenwei Wang"},{"text":"Sihui Hao"},{"text":"Yixiang Song"},{"text":"Jianyun Xu"}],"source":{"label":"Crossref","url":"https://doi.org/10.32604/cmes.2026.086481"}},{"key":"published","label":"Published","values":[{"text":"2026","date":"2026"}],"source":{"label":"Crossref","url":"https://doi.org/10.32604/cmes.2026.086481"}},{"key":"publisher","label":"Publisher","values":[{"text":"Tech Science Press"}],"source":{"label":"Crossref","url":"https://doi.org/10.32604/cmes.2026.086481"}},{"key":"journal","label":"Journal","values":[{"text":"Computer Modeling in Engineering & Sciences"}],"source":{"label":"Crossref","url":"https://doi.org/10.32604/cmes.2026.086481"}},{"key":"doi","label":"DOI","values":[{"text":"10.32604/cmes.2026.086481","url":"https://doi.org/10.32604/cmes.2026.086481"}],"source":{"label":"Crossref","url":"https://doi.org/10.32604/cmes.2026.086481"}},{"key":"license","label":"Licence","values":[{"text":"https://doi.org/10.32604/TSP-CROSSMARKPOLICY","url":"https://doi.org/10.32604/TSP-CROSSMARKPOLICY"}],"source":{"label":"Crossref","url":"https://doi.org/10.32604/cmes.2026.086481"}}],"office":null,"sections":[],"cited":[],"cited_from":null,"videos":[],"last_reviewed":null,"organizations":[],"same_as":["https://doi.org/10.32604/cmes.2026.086481"],"faq":[{"q":"Who wrote Topological Optimisation Design of Nanofluid-Cooled Microchannel Heat Sink Using a Three-Layer Thermofluid Model for Electronics Cooling?","a":"Topological Optimisation Design of Nanofluid-Cooled Microchannel Heat Sink Using a Three-Layer Thermofluid Model for Electronics Cooling was written by Bin Zhang, Xuanyan Lu, Zhigang Qin, Yibo Mo."},{"q":"When was Topological Optimisation Design of Nanofluid-Cooled Microchannel Heat Sink Using a Three-Layer Thermofluid Model for Electronics Cooling first published?","a":"Topological Optimisation Design of Nanofluid-Cooled Microchannel Heat Sink Using a Three-Layer Thermofluid Model for Electronics Cooling was first published in 2026."}],"related":[],"places_in":[],"nearby":[],"image":null,"sources":[{"label":"Publisher record (DOI, via Crossref)","url":"https://doi.org/10.32604/cmes.2026.086481","license":null}],"license":null,"attribution":"Open-access publication. Read it free at the publisher: https://doi.org/10.32604/cmes.2026.086481.","cite":"\"Topological Optimisation Design of Nanofluid-Cooled Microchannel Heat Sink Using a Three-Layer Thermofluid Model for Electronics Cooling\". DigiNepal. Last updated 2 November 2026. https://diginpl.com/books/paper-cmes-2026-086481. Retrieved 14 November 2026.","date_modified":"2026-11-02T06:46:37Z","facts_checked":"2026-11-02","alternates":{"html":"https://diginpl.com/books/paper-cmes-2026-086481","en":"https://diginpl.com/books/paper-cmes-2026-086481","ne":null}}