# Topological Optimisation Design of Nanofluid-Cooled Microchannel Heat Sink Using a Three-Layer Thermofluid Model for Electronics Cooling

_Computer Modeling in Engineering & Sciences · Bin Zhang, Xuanyan Lu, Zhigang Qin et al. · 2026_

Canonical: https://diginpl.com/books/paper-cmes-2026-086481
Last updated: 2026-11-02

## Quick facts

- **Author:** Bin Zhang; Xuanyan Lu; Zhigang Qin; Yibo Mo; Chenwei Wang; Sihui Hao; Yixiang Song; Jianyun Xu ([Crossref](https://doi.org/10.32604/cmes.2026.086481))
- **Published:** 2026 ([Crossref](https://doi.org/10.32604/cmes.2026.086481))
- **Publisher:** Tech Science Press ([Crossref](https://doi.org/10.32604/cmes.2026.086481))
- **Journal:** Computer Modeling in Engineering & Sciences ([Crossref](https://doi.org/10.32604/cmes.2026.086481))
- **DOI:** 10.32604/cmes.2026.086481 ([Crossref](https://doi.org/10.32604/cmes.2026.086481))
- **Licence:** https://doi.org/10.32604/TSP-CROSSMARKPOLICY ([Crossref](https://doi.org/10.32604/cmes.2026.086481))

## Questions

**Who wrote Topological Optimisation Design of Nanofluid-Cooled Microchannel Heat Sink Using a Three-Layer Thermofluid Model for Electronics Cooling?**  
Topological Optimisation Design of Nanofluid-Cooled Microchannel Heat Sink Using a Three-Layer Thermofluid Model for Electronics Cooling was written by Bin Zhang, Xuanyan Lu, Zhigang Qin, Yibo Mo.

**When was Topological Optimisation Design of Nanofluid-Cooled Microchannel Heat Sink Using a Three-Layer Thermofluid Model for Electronics Cooling first published?**  
Topological Optimisation Design of Nanofluid-Cooled Microchannel Heat Sink Using a Three-Layer Thermofluid Model for Electronics Cooling was first published in 2026.

## Sources

- [Publisher record (DOI, via Crossref)](https://doi.org/10.32604/cmes.2026.086481)

## Licence and attribution

Open-access publication. Read it free at the publisher: https://doi.org/10.32604/cmes.2026.086481.

## Cite this page

"Topological Optimisation Design of Nanofluid-Cooled Microchannel Heat Sink Using a Three-Layer Thermofluid Model for Electronics Cooling". DigiNepal. Last updated 2 November 2026. https://diginpl.com/books/paper-cmes-2026-086481. Retrieved 14 November 2026.