{"id":"paper-icces-2026-014290","type":"book","url":"https://diginpl.com/books/paper-icces-2026-014290","language":"en","name":"Fracture Analysis of Through-Glass Via (TGV) Interposer Under Thermal Loading Based on the Extended Finite Element Method (XFEM)","name_en":"Fracture Analysis of Through-Glass Via (TGV) Interposer Under Thermal Loading Based on the Extended Finite Element Method (XFEM)","name_ne":null,"description":"The International Conference on Computational & Experimental Engineering and Sciences · Yuqing Lu, Jun Wang · 2026","headline":"The International Conference on Computational & Experimental Engineering and Sciences · Yuqing Lu, Jun Wang · 2026","also_known_as":[],"summary":"","summary_more":[],"facts":[{"key":"authors","label":"Author","values":[{"text":"Yuqing Lu"},{"text":"Jun Wang"}],"source":{"label":"Crossref","url":"https://doi.org/10.32604/icces.2026.014290"}},{"key":"published","label":"Published","values":[{"text":"2026","date":"2026"}],"source":{"label":"Crossref","url":"https://doi.org/10.32604/icces.2026.014290"}},{"key":"publisher","label":"Publisher","values":[{"text":"Tech Science Press"}],"source":{"label":"Crossref","url":"https://doi.org/10.32604/icces.2026.014290"}},{"key":"journal","label":"Journal","values":[{"text":"The International Conference on Computational & Experimental Engineering and Sciences"}],"source":{"label":"Crossref","url":"https://doi.org/10.32604/icces.2026.014290"}},{"key":"doi","label":"DOI","values":[{"text":"10.32604/icces.2026.014290","url":"https://doi.org/10.32604/icces.2026.014290"}],"source":{"label":"Crossref","url":"https://doi.org/10.32604/icces.2026.014290"}}],"office":null,"sections":[],"cited":[],"cited_from":null,"videos":[],"last_reviewed":null,"organizations":[],"same_as":["https://doi.org/10.32604/icces.2026.014290"],"faq":[{"q":"Who wrote Fracture Analysis of Through-Glass Via (TGV) Interposer Under Thermal Loading Based on the Extended Finite Element Method (XFEM)?","a":"Fracture Analysis of Through-Glass Via (TGV) Interposer Under Thermal Loading Based on the Extended Finite Element Method (XFEM) was written by Yuqing Lu, Jun Wang."},{"q":"When was Fracture Analysis of Through-Glass Via (TGV) Interposer Under Thermal Loading Based on the Extended Finite Element Method (XFEM) first published?","a":"Fracture Analysis of Through-Glass Via (TGV) Interposer Under Thermal Loading Based on the Extended Finite Element Method (XFEM) was first published in 2026."}],"related":[],"places_in":[],"nearby":[],"image":null,"sources":[{"label":"Publisher record (DOI, via Crossref)","url":"https://doi.org/10.32604/icces.2026.014290","license":null}],"license":null,"attribution":"Open-access publication. Read it free at the publisher: https://doi.org/10.32604/icces.2026.014290.","cite":"\"Fracture Analysis of Through-Glass Via (TGV) Interposer Under Thermal Loading Based on the Extended Finite Element Method (XFEM)\". DigiNepal. Last updated 5 November 2026. https://diginpl.com/books/paper-icces-2026-014290. Retrieved 14 November 2026.","date_modified":"2026-11-05T06:42:23Z","facts_checked":"2026-11-05","alternates":{"html":"https://diginpl.com/books/paper-icces-2026-014290","en":"https://diginpl.com/books/paper-icces-2026-014290","ne":null}}