# Effect of Cladding Materials, Interpass Temperature, and Thickness Parameters on Deformation Behavior in WAAM—Experiments and Simulations

_Computers, Materials &amp; Continua · Xiaodong Zhao, Wenjia Huang, Kun Cui et al. · 2026_

Canonical: https://diginpl.com/books/paper-cmc-2026-089847
Last updated: 2026-10-28

## Quick facts

- **Author:** Xiaodong Zhao; Wenjia Huang; Kun Cui; Yueri Tai; Hongtao Zhu; Haiyan Zhao; Ninshu Ma ([Crossref](https://doi.org/10.32604/cmc.2026.089847))
- **Published:** 2026 ([Crossref](https://doi.org/10.32604/cmc.2026.089847))
- **Publisher:** Tech Science Press ([Crossref](https://doi.org/10.32604/cmc.2026.089847))
- **Journal:** Computers, Materials &amp; Continua ([Crossref](https://doi.org/10.32604/cmc.2026.089847))
- **DOI:** 10.32604/cmc.2026.089847 ([Crossref](https://doi.org/10.32604/cmc.2026.089847))

## Questions

**Who wrote Effect of Cladding Materials, Interpass Temperature, and Thickness Parameters on Deformation Behavior in WAAM—Experiments and Simulations?**  
Effect of Cladding Materials, Interpass Temperature, and Thickness Parameters on Deformation Behavior in WAAM—Experiments and Simulations was written by Xiaodong Zhao, Wenjia Huang, Kun Cui, Yueri Tai.

**When was Effect of Cladding Materials, Interpass Temperature, and Thickness Parameters on Deformation Behavior in WAAM—Experiments and Simulations first published?**  
Effect of Cladding Materials, Interpass Temperature, and Thickness Parameters on Deformation Behavior in WAAM—Experiments and Simulations was first published in 2026.

## Sources

- [Publisher record (DOI, via Crossref)](https://doi.org/10.32604/cmc.2026.089847)

## Licence and attribution

Open-access publication. Read it free at the publisher: https://doi.org/10.32604/cmc.2026.089847.

## Cite this page

"Effect of Cladding Materials, Interpass Temperature, and Thickness Parameters on Deformation Behavior in WAAM—Experiments and Simulations". DigiNepal. Last updated 28 October 2026. https://diginpl.com/books/paper-cmc-2026-089847. Retrieved 7 November 2026.
